Hot3D logo7th IEEE International Workshop
on Hot Topics in 3D - Hot 3D 

Seattle, USA, July 11, 2016

(in conjunction with ICME'16)


(Dec 30, 2015): new Hot'3D website is up.


The 3D research community is at a potentially revolutionary point. From one side, 3D display technology, including autostereoscopic displays, is at the verge of becoming widespread and reasonably priced. From another direction, increases in computational power – including powerful GPUs – and novel formats — including UHD-3D — allow for an ever-increasing realism in 3D scene generation and display. 3D audio is now often tightly integrated with 3D environments. Haptic systems are also being tightly integrated within 3D systems. Quality evaluation of 3D systems itself is of great importance, and is also showing fast progress. Finally, new depth cameras, coupled with new 3D analysis and synthesis algorithms, are close to enable commercial-quality 3D rendering of real scenes, instead of being restricted to synthetic scenes as in the past.

All these factors together create the “perfect storm”: an environment prone for an explosion of related technology and applications, with a speed of development that will not fit in the (slower) cycle of traditional conferences and journals. In other words, while appropriate venues for presenting research at advanced stages is plentiful, the 3D Multimedia community lacks an appropriate venue for receiving feedback during early or initial stages of the development of radical or potentially disruptive technology. This is exactly the void that Hot3D tries to fill. After the enormous success of the previous Hot3D in Singapore (2010), Barcelona (2011), Melbourne (2012), San Jose (2013), Chengdu (2014), Torino(2015), 2016 is again expected to represent a premier venue, providing an environment for lively discussion of early-stage, potentially disruptive research.


Papers in all areas of Multimedia 3D are solicited. Early stage or preliminary results from potentially disruptive technology are particularly encouraged. Full papers (up to 6 pages) will be published in the ICME proceedings.

Additionally, and maybe most importantly, position papers are solicited for short presentation and discussion of preliminary work or ideas. Submit a proposal of up to 2 pages, with a decision expected up to 3 weeks after submission.

The 1-day workshop will be co-located with ICME, the flagship multimedia conference sponsored by four IEEE societies. The workshop will be a unique opportunity to interact with other researchers working on 3D Multimedia. With an environment designed to facilitate discussion and feedback in early stage research, as well as forge new collaborations, this is an event not to be missed. Please submit your papers here, following the authors’ guidelines.


Submit Regular Paper (up to 6 pages) by:
March 18, 2016 March 25, 2016

Notification of Regular Paper Acceptance: April 22, 2016
Camera-Ready Paper Due: May 13, 2016

Position Paper (up to 2 pages) Submission: ASAP, up to May 15, 2016
Notification of (Position Paper) Acceptance: April 16, or 3 weeks after submission.